| 摘要 | 第1-5页 |
| Abstract | 第5-10页 |
| Chapter 1 Introduction | 第10-19页 |
| ·Background, objectives and significance of this subject | 第10-11页 |
| ·Studying actualities in correlative subject internationally | 第11-17页 |
| ·Research on solder materials of BGA solder interconnections | 第12-14页 |
| ·Research on reliability of BGA solder interconnections | 第14-17页 |
| ·The aim and study field of this paper | 第17-19页 |
| Chapter 2 Equipments and Experiment Projects | 第19-26页 |
| ·Equipments used in experiment | 第19-21页 |
| ·Experiment projects | 第21-26页 |
| ·Thermal cycling test for usual products | 第22-23页 |
| ·Thermal shock test for aero & defensive industry products | 第23-24页 |
| ·Mechanical fatigue test for SAC305 solder samples | 第24页 |
| ·Aging test for SAC305 solder samples | 第24-25页 |
| ·The analysis of test results | 第25-26页 |
| Chapter 3 OM observation of samples after cycling | 第26-32页 |
| ·Introduction of this chapter | 第26页 |
| ·OM images of samples after different thermal cycles | 第26-30页 |
| ·OM images of original samples | 第26-27页 |
| ·OM images of samples after 1400 thermal cycling | 第27-28页 |
| ·OM images of samples after 3000 thermal cycling | 第28-29页 |
| ·Analysis and conclusion | 第29-30页 |
| ·OM images of samples in mechanical fatigue test | 第30-31页 |
| ·Conclusions in this chapter | 第31-32页 |
| Chapter 4 Research on grain orientation changes | 第32-43页 |
| ·Introduction of this chapter | 第32页 |
| ·The grain orientation changes in thermal cycling | 第32-36页 |
| ·The crystal structure of original samples | 第32-33页 |
| ·The crystal structure of samples after 1400 cycles | 第33-34页 |
| ·The crystal structure of samples after 3000 cycles | 第34-36页 |
| ·The grain orientation changes in thermal shock test | 第36-38页 |
| ·Grain orientation changes of SAC305 lead–free solder samples | 第36-37页 |
| ·Grain orientation changes of in–situ samples | 第37-38页 |
| ·The grain orientation changes in mechanical fatigue test | 第38-39页 |
| ·Analysis of grain orientation changes | 第39-42页 |
| ·Conclusions in this chapter | 第42-43页 |
| Chapter 5 Research on composition changes | 第43-62页 |
| ·Induction of this chapter | 第43页 |
| ·The composition changes in thermal cycling test | 第43-54页 |
| ·Observation of Sn–Pb eutectic solder samples under SEM | 第43-46页 |
| ·Observation of mixed solder samples under SEM | 第46-50页 |
| ·Observation of SAC305 lead free solder samples under SEM | 第50-54页 |
| ·The composition changes in thermal shock test | 第54-56页 |
| ·Observation of oridinary samples under SEM | 第54-55页 |
| ·Observation of in–situ observed samples under SEM | 第55-56页 |
| ·The composition changes in mechanical fatigue test | 第56-58页 |
| ·The composition changes in aging test | 第58-59页 |
| ·Analysis of composition changes under fatigue loading | 第59-60页 |
| ·Conclusions in this chapter | 第60-62页 |
| Chapter 6 Research on mechanical property changes | 第62-70页 |
| ·Introduction of this chapter | 第62页 |
| ·Hardness values of samples in thermal cycling test | 第62-67页 |
| ·Hardness values of Sn–Pb eutectic solder samples samples | 第62-64页 |
| ·Hardness values of mixed solder samples | 第64-66页 |
| ·Hardness values of SAC305 solder samples | 第66-67页 |
| ·Hardness values of samples in mechanical fatigue test | 第67-68页 |
| ·Analysis of hardness changes infatigue tests | 第68-69页 |
| ·Conclusions in this chapter | 第69-70页 |
| Conclusions | 第70-72页 |
| References | 第72-80页 |
| 致谢 | 第80页 |
