ACKNOWLEDGEMENTS | 第4-5页 |
致谢 | 第5-6页 |
ABSTRACT | 第6页 |
摘要 | 第7-21页 |
CHAPTER 1 INTRODUCTION | 第21-46页 |
1.1 Research Background | 第21-42页 |
1.1.1 Definition and function of copper clad laminate | 第21-23页 |
1.1.2 Present status and development process of global copper clad laminateindustry | 第23-32页 |
1.1.3 The basic situation of the leading CCL enterprises in China-SYCompany | 第32-42页 |
1.1.4 Research objectives, contents and key problems | 第42页 |
1.2 Thesis significance | 第42页 |
1.3 Thesis logic structure and analysis tools | 第42-46页 |
CHAPTER 2 LITERATURE REVIEW OF RELEVANT RESEARCH | 第46-67页 |
2.1 Relevant Research on Modularity | 第46-50页 |
2.2 Research on platform and product family | 第50-60页 |
2.2.1 Product family design and platform-based product development | 第50-57页 |
2.2.2 Product portfolio and product family positioning | 第57页 |
2.2.3 Platform-based product family design | 第57页 |
2.2.4 Metrics for product family design | 第57-58页 |
2.2.5 Product family design support systems | 第58页 |
2.2.6 Manufacturing and production for product families | 第58-59页 |
2.2.7 Prospects for future research | 第59-60页 |
2.3 Research on modularization, platform and standardization strategy ofenterprise | 第60-62页 |
2.4 Typical examples in related fields | 第62-65页 |
2.5 Literature Review and Definitions of Key Terms | 第65-67页 |
CHAPTER 3 THE NECESSITY AND FEASIBILITY OF PLATFORMIZATIONCARRIED OUT IN SY COMPANY | 第67-74页 |
3.1 Unclear Product Strategies and Product Planning, Lacking in ProductPortfolio Management | 第67页 |
3.2 Overlong New Product Development Cycle | 第67-69页 |
3.3 Redundant Research and Insufficient Sharing and Reuse of Technology | 第69页 |
3.4 The Feasibility and Roadmap of Platformization Carried Out in SY Company | 第69-74页 |
CHAPTER 4 THE EXPLORATION AND ROADMAP OF SY COMPANY’SPLATFORMIZATION | 第74-118页 |
4.1 The Exploration and Roadmap of SY Company’s Platformization | 第74-85页 |
4.1.1 Analyzing and Building Technology Platform from the Perspective ofProducts | 第74-76页 |
4.1.2 Identification and Categorization of Technologies Adopted in theTechnology Platform | 第76-77页 |
4.1.3 Layout and Application of Patents for Products, Technology Platformthat Supports Products and Technologies Used in the Platform | 第77页 |
4.1.4 Figuring Out the Relationship among the Market, Product, Platform andTechnology | 第77-79页 |
4.1.5 Determine the Capability of the Platform and the Modular Function ofthe Platform | 第79-85页 |
4.2 Analyze and Determine the Technology Platform for the Production ofConceptual Products | 第85-87页 |
4.3 Adopt Platformization Perspectives and Methods to Study Competitors andSY Company | 第87-94页 |
4.3.1 Company I of America | 第87-91页 |
4.3.2 Company E | 第91-93页 |
4.3.3 The New Product Development Case of SY Company ——S18* | 第93-94页 |
4.4 Building of platformized and modularized knowledge base/ technologylibrary /standard library | 第94-105页 |
4.5 Operating mode under the platform reform | 第105-112页 |
4.5.1 Technology research focusing on technology platform | 第105-107页 |
4.5.2 To form brand platform through product portfolio management, andeffectively coordination with the product platform | 第107-108页 |
4.5.3 Supply chain management under platformization reform | 第108-109页 |
4.5.4 The Third-party Safety Certification Based on the Technology Platform | 第109-111页 |
4.5.5 To Comprehensively Protect the Technologies, Technology platformsand Products Through the Design of Patent Portfolio | 第111-112页 |
4.6 Making Solid Foundation for Cross-enterprise Innovation | 第112-115页 |
4.6.1 Organization Design and Establishment of R&D Management System | 第112-113页 |
4.6.2 Implementing PLM to ensure the realization of platformization andmodularization in Production | 第113-115页 |
4.7 Expected Objectives and Returns of SY Company’s Platformization Reform | 第115-118页 |
CHAPTER 5 CONCLUSION | 第118-120页 |
REFERENCES | 第120-123页 |