| Abstract | 第1-8页 |
| 摘要 | 第8-21页 |
| 1.Introduction | 第21-39页 |
| ·Background | 第22-23页 |
| ·Planar Microbubbles | 第23页 |
| ·Intermetallic Compounds | 第23页 |
| ·Research Trends about Interfacial Voids in Lead-free Solders | 第23-24页 |
| ·Research Trends about Intermetallic Compound Growth in presence of Field Gra-dient | 第24-25页 |
| ·Use of Synchrotron Radiation Real-time Imaging Technique for Observation of Interfacial Phenomena in Liquid Solder Joints | 第25-27页 |
| ·Finite Element Methods and Numerical Simulation Softwares | 第27-31页 |
| ·Elmer Multiphysics Software | 第28-30页 |
| ·MOOSE Framework | 第30-31页 |
| ·Finite Volume Methods and FiPy | 第31-33页 |
| ·CALPHAD,Thermodynamics and Chemical Kinetics Softwares | 第33-35页 |
| ·Cantera | 第34页 |
| ·OpenCalphad | 第34-35页 |
| ·Research Objectives and Structural Framework of Dissertation | 第35-39页 |
| 2 Experimental Materials,Procedures and Numerical Methods | 第39-45页 |
| ·Introduction | 第39页 |
| ·Bubble Growth Experimental Setup | 第39-40页 |
| ·Experimental Setup for IMC Growth under Thermomigration | 第40-41页 |
| ·Experimental Setup for Bubbles and IMC under Thermal Gradient | 第41-42页 |
| ·In-situ Experimental Observation of IMC Growth under Electromigration | 第42-43页 |
| ·Numerical Methodology | 第43-44页 |
| ·Summary | 第44-45页 |
| 3 Thermodynamic and Kinetic Modelling of Bubble and Liquid Solders | 第45-53页 |
| ·Introduction | 第45页 |
| ·Related Works | 第45-46页 |
| ·Calculation of K_c for Gas Bubble/Liquid Solder Interface through Cantera Soft-ware | 第46-48页 |
| ·Thermodynamic description of Sn, Sn-Cu and Sn-Ag-Cu sytem using OpenCal-phad | 第48-51页 |
| ·Summary | 第51-53页 |
| 4 Interfacial Bubbles in Liquid-Solid Sn Solder/Cu Substrate | 第53-81页 |
| ·Introduction | 第53页 |
| ·Related Works | 第53-54页 |
| ·Experimental Results for the Bubble Growth Study | 第54-58页 |
| ·In-situ synchrotron radiation experiments for the bubble profile observation | 第54-55页 |
| ·Scanning electron microscopy images of solder void and affected IMC | 第55-57页 |
| ·Experimentally obtained mean diameter of the bubble | 第57-58页 |
| ·Mathematical Formulation of the Bubble Growth Model | 第58-66页 |
| ·Theory of Diffusion-driven Bubble Growth | 第58-59页 |
| ·Numerical Model | 第59-66页 |
| ·Experimental observation of the merging phenomena of the multiple bubbles | 第66-67页 |
| ·Effective material properties of solders with interfacial bubbles | 第67-79页 |
| ·Diffusion coefficient of Cu in composite liquid solders | 第69-74页 |
| ·Feedback of interfacial bubbles to thermal gradient | 第74-79页 |
| ·Summary | 第79-81页 |
| 5 Increase of Thickness of Cold Side Cu_6Sn_5 IMC in Cu/liquid Sn/Cu and Cu/liquid SnAg/Cu undergoing Thermomigration | 第81-92页 |
| ·Introduction | 第81页 |
| ·Related Works | 第81-82页 |
| ·Results from the Experimental Observation | 第82-83页 |
| ·Mathematical Formulation of Thermodiffusion in Cu/liquid Sn/Cu and Numerical Method | 第83-87页 |
| ·Theory of thermophoresis in Substrate/molten Solder/Substrate System | 第83-85页 |
| ·FEM Formulation of Thermodiffusion Convection Kernel in MOOSE frame-work | 第85-86页 |
| ·Numerical Implementation in MOOSE:Finite Element Analysis Software | 第86-87页 |
| ·Comparison between Experimental and Numerical Results | 第87-88页 |
| ·Inhibitory Effect of Ag_3Sn nanoparticles on the Growth of Cu_6Sn_5 compound | 第88-89页 |
| ·Summary | 第89-92页 |
| 6 Increase of Thickness of Anode Cu_6Sn_5 IMC in Cu/liquid Sn/Cu undergoing Electro-migration | 第92-108页 |
| ·Introduction | 第92页 |
| ·Related Works | 第92-93页 |
| ·Determination of product of Diffusion Coefficient and Effective Charge Number | 第93页 |
| ·Experimental Results and Discussion | 第93-94页 |
| ·Mathematical Formulation of the Electromigration Phenomenon | 第94-102页 |
| ·Joule Heating in Solders | 第97页 |
| ·Computation of Joule Heating via FEM | 第97-99页 |
| ·Computation of Anode IMC thickness via FVM | 第99-100页 |
| ·FEM Calculation of Anode IMC thickness | 第100-102页 |
| ·Role of Current Density Magnitude and Sample Size in the IMC Thickness In-crease | 第102-106页 |
| ·Summary | 第106-108页 |
| 7 Conclusion and Future Work | 第108-113页 |
| ·Conclusion | 第108-111页 |
| ·Future Work | 第111-113页 |
| Abstract of Innovation Points | 第113-115页 |
| 创新点（中文） | 第115-116页 |
| References | 第116-129页 |
| Published Academic Theses during PhD Period | 第129-131页 |
| Acknowledgement | 第131-133页 |
| About the Author | 第133-135页 |
