中文摘要 | 第4-9页 |
Abstract | 第9-10页 |
Preface | 第11-22页 |
List of Symbols | 第22-24页 |
Chapter 1 Context of study | 第24-42页 |
1.1 Thin film techniques and applications | 第24-27页 |
1.1.1 Background | 第24-26页 |
1.1.2 Thin film deposition processes | 第26-27页 |
1.2 Microstructure and mechanics | 第27-30页 |
1.2.1 X-ray diffraction (XRD) | 第27-28页 |
1.2.2 Fiber texture and elastic anisotropy | 第28-30页 |
1.3 Mechanical properties and research approaches of metallicthin films | 第30-40页 |
1.3.1 Residual stresses | 第30-32页 |
1.3.2 Adhesion and characterization techniques of mechanical behavior | 第32-37页 |
1.3.3 Bauschinger effect (BE) | 第37-40页 |
1.4 Strategy | 第40-42页 |
Chapter 2 Experimental design and research methods | 第42-66页 |
2.1 Substrates design for mechanical testing | 第42-45页 |
2.2 Development of setups adapted to Deben MICROTEST andX-ray diffractometer | 第45-50页 |
2.3 Sputtering methods and conditions | 第50-54页 |
2.3.1 Residual stress control of thin metal films in PUMA | 第50页 |
2.3.2 Film deposition for pre-tensile specimens in NORDIKO | 第50页 |
2.3.3 Film deposition on both sides of a substrate over half of the gaugelength | 第50-54页 |
2.4 Initial characterizations of as-deposited thin films | 第54页 |
2.5 Mechanical testing and stress/strain measurements | 第54-64页 |
2.5.1 In situ uniaxial tensile and compressive testing | 第54页 |
2.5.2 True strain measurements (DIC) | 第54-61页 |
2.5.3 Applied lattice strain and residual stress measurements | 第61-64页 |
2.6 Summary | 第64-66页 |
Chapter 3 Determining the Young’s modulus of thin films bya dual DIC system | 第66-94页 |
3.1 Mechanical analysis | 第66-68页 |
3.2 Finite element method (FEM) | 第68-70页 |
3.3 Development of a dual DIC system combined with the ten-sile testing | 第70-72页 |
3.3.1 Experimental approach and true strain measurements | 第70-72页 |
3.3.2 Validation of the home-made system | 第72页 |
3.4 Strain transfer through interface and the curvature evolutionduring a tensile testing | 第72-85页 |
3.4.1 Characteristics of as-deposited thin films | 第72-74页 |
3.4.2 Strain transfer from the substrate to films with various materialsand thicknesses | 第74-79页 |
3.4.3 Curvature evolution measurements by an optical three-dimensionalprofiler | 第79页 |
3.4.4 Simulation model and comparison | 第79-85页 |
3.5 Young’s modulus determination of various thin metal filmscoated on both sides of Kapton | 第85-92页 |
3.6 Conclusions | 第92-94页 |
Chapter 4 Cyclic testing of thin nanometric films combiningXRD and DIC analysis | 第94-106页 |
4.1 Development of a pre-stretching technique combined withXRD and DIC measurements | 第94-97页 |
4.1.1 Overview of the cyclic testing techniques for thin films | 第94-95页 |
4.1.2 Independent development of pre-stretching technique | 第95-97页 |
4.2 Cyclic testing and elastic stress/true strain measurements ofthin Ni films | 第97-102页 |
4.3 Bauschinger effect and cyclic strain hardening investiga-tions in thin nickel films on a Kapton?substrate | 第102-105页 |
4.4 Conclusions | 第105-106页 |
Chapter 5 General conclusions and perspectives | 第106-110页 |
5.1 General conclusions | 第106-107页 |
5.2 Perspectives | 第107-110页 |
Bibliography | 第110-118页 |
Appendix | 第118-122页 |
List of Publications | 第122-124页 |
Acknowledgements | 第124-125页 |